Hall A2, Booth 540

AIM Solder plus Support

Our new partner for solder materials

• The company produces solder paste, liquid flux,
cored wire, bar solder, underfills, adhesives,
preforms and specialty alloys such as indium and
gold for the electronics assembly, PC fabrication,
component manufacturing and other industries.

• NC257-2 SN100C® SOLDER PASTE
Jet Printable Solder Paste
• AIM’s manufacturing locations expect to receive
ISO 9001:2008 certification by early 2010.

Halle A2, Stand 405

DEK International

Process Support & Engineeres Products
• VectorGuard Stencil technology
• Magna-Print™ new magnet squeegee system
• Stinger™ makes any printer for dispenser

Machines / Software
• Brand new Sentinel Technology.
Make sure that each PCB is a good PCB.
This modern technology includes innovative
features such as a complete input and output
verification in conjunction with 100% inspection
at line speed.
• New OTS PCB clamping system and other
Process optimization.

<---

Hall A2, Booth 259

EBSO

• Selective Soldering
• Component pre-forming and preparation
• Depanelize
• Solder fume absorber
• Insertion machines for solder tags

Hall A3, Booth 358

ESSEMTEC AG

• Placer 9.0 New Software
• PANFLEX2 Modular Pick&Placer
Eco-Version (2 Modules)
• Pantera XV Pick&Placer for KMU´s
• Semiautomatic Fine Pitch Elementes
Pick&Placer MPL 3200

<--- Homepage - just click!

Hall A4, Booth 232

HANS KOLB Wellpappe GmbH

• WRAPTRONIC permanently conductive
and Universal Packaging System
• WRAPTRONIC AIR permanently conductive
and Universal Packaging System with shockproof
• Protection CORSTAT™ - CORTRONIC® against
ESD hazards

<--- KOLB Display- The online special!

Hall A4, Booth 163

Kolb Cleaning Technology GmbH

• Mechanical Engineering: BCP-cleaning system
• Cleaning chemistry
• Technology Development
• Process design & Services

<--- Homepage - just click!

Hall A4, Booth 127

OK INTERNATIONAL

• APR-5000 boasts new features and improved
performance! “New and Improved” is genuinely the
case with the APR-5000 XL/XLS Array Package
Rework System.

• The wait is over; our new modular rework
system is here! Allow us to introduce the
MRS-1000 Modular Rework System, designed to
enhance the removal and placement of BGA/CSP
and SMT components.

<--- More details about MRS-1000 !

Hall A4, Booth 127

OVATION PRODUCTS

• new High Density Module
• new Grid-Lok™ Boothard Syteme
• Magna-Print™ new magnet squeegee system
• Stinger™ makes any printer for dispenser

<--- Homepage - just click!

Hall A2, Booth 165

SAKI Europe GmbH

• World premiere
BF X1 - 3D inline planar CT system
• CT 350 Sub µm 3D CT system
• New high resolution Benchtop AOI system
• New automatic coating inspection machine
• New real inline 3D CT system with cycle time
below 30s
• Complete inspection solutions:
SPI – AOI – AXI - NDT

Hall A4, Booth 542

Vitronics Soltec GmbH

• New MyReflow 1040N with FAST COOLING
and modified flux management GRS
• New MySelect 6745++
• New MySelect 6748 with multi- and
selective wave applications
• EASY TEACH II for the whole selective platform

<--- 5 Steps to Lead Free Soldering!

Hall A2, Booth 540

ZEVAC AG

• ONYX 21, 24, 25 and 29
• ONYX 32 HOTGAS
• IP-520 The logical extension is to large quantities
in an in-line Production environment designed

<--- Design award for ZEVAC‘s latest model of the ONYX product line.