.:: ZEVAC SSM 4 ::.

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Austria and Slovenia:
Jens-Christian Thomsen
+43 1 74040 221
+43 664 3006534
jc.thomsen(at)att.co.at

Romania and Bulgaria:
Stanco Vucovan
+36 22 505882
+40 733 104567
s.vucovan(at)att.co.at

Czech Rep. and Slovakia:
Ing. Pavel Tomásek
+421 903465339
p.tomasek(at)att.co.at

Hungary:
István Bögyös
+36 22 505882
+36 20 94 95 477
i.bogyos(at)att.co.at

home » facilities » soldering » selective soldering » ZEVAC SSM 4

ZEVAC SSM 4

		SSM 4 For selective soldering and desoldering of Through Hole Technology applications. Reproducible results by operation parameters.
Technical design The SSM 4 is the entry machine version of the SSM series. It is outlined for fast selective soldering and desoldering options for changing applications.
Application range For repair, prototyping, soldering, retrofit and small series production on the entire field of selective soldering and desoldering in the Through Hole Technology. Defective components can be removed and new components soldered in place even on dense-populated, mixed technology and / or multilayer printed circuit boards.
Application specific flow direction Depending on the design of the board the flow off sides can be from one to all 4 sides of a flow well. The combination of flow well design and parameter settings assure the continuous flow of the liquid solder in the desired way. The flow wells and / or cleaning hoods can be used on all machines of the SSM series.

SSM 4 key features summary
EASY TO USE ENTRY MODEL	for leaded or leadfree operation
ADJUSTABLE PARAMETERS
STABLE CONSTRUCTION	stable table top machine
VARIOUS OPTIONS	like board holder, blow out system or protective gas operation
APPLICATION SPECIFIC TOOLING	for any kind of component also on dense populated board, including multi soldering solutions, for wetting on defined positions
RETROFIT FOR LEADFREE	leadfree retrofit for machines already in operation available

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