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home » facilities » soldering » selective soldering » ZEVAC SSM 9

ZEVAC SSM 9

SSM 9

For selective soldering and desoldering of Through Hole Technology applications. Reproducible results by programmable parameters.


Technical design

The SSM 9 is ideal for a wide range of soldering applications.

 


Application range

For repair, prototyping, soldering, retrofit and small series production on the entire field of selective soldering and desoldering in the Through Hole Technology. Defective components can be removed and new components soldered in place even on dense-populated, mixed technology and / or multilayer printed circuit boards.

 

Board carrier

For easy and fast positioning of the printed circuit board over the flow well, ready for the through hole rework process.

 
preheater module ph4

The selective soldering and desoldering machine SSM 9 can be combined with the standalone preheater module PH4 to preheat the printed circuit board smoothly up to the predefined working temperature. Detail description PH4.
 
SSM 9 key features summary

FLEXIBLE SOLUTIONS

for standard or odd shaped components

PROGRAMMABLE PARAMTERS

can be stored and recalled on demand

HEIGHT ADJUSTMENT

easy height adjustment of the printed circuit board over the flow well

STABLE CONSTRUCTION

easy to use and stable table top machine

BOARD HOLDER

even irregular shaped printed circuit boards up to 840x600mm can be fixed on the quick locking board holder

BLOW-OUT OPTION

to clean the solder joints after removal of a connector

APPLICATION SPECIFIC TOOLING

for any kind of component also on dense populated board, including multi soldering solutions, for wetting on defined positions

PREHEATER MODULE PH4

The standalone preheater module PH4 can be connected, especially for the increased lead-free requirements

RETROFIT FOR LEADFREE

leadfree retrofit for machines already in operation available


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