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Vitronics
Soltec - myReflow
The
myReflow-Serie
series has rapidly build up a reputation to achieve the lowest delta T's at the
highest conveyor speeds and is best positioned to support your lead-free process
requirements.
myReflow
meets the lead-free challenge! Going
'Lead-free' means a smaller process window for reflow soldering; for example,
melting temperatures must be higher, but maximum allowed component temperatures
remain fixed! Combined minimum and maximum time limits above liquidous result
in a smaller operating time-temperature process window. It's the big lead-free
'squeeze'! This makes it tough to develop optimum profiles while maintaining process
speed.
myReflow
- Better heat transfer beats the "Squeeze" Increased
heat transfer from gas to product relieves the 'squeeze'. myReflow.com does this
with an improved gas re-circulation flow efficiency design. Component temperatures
can now reach higher levels without higher set points. Maximum component temperatures
are therefore limited while delta-T's in the peak-zone are minimal.
Configure
your own customized system . . . Many
options are available to configure the myReflow oven to your own specification.
Gas filtration, multiple board support systems, various software options, high
performance cooling units, integrated gas management, dual lane conveyor, UPS,
and many more items can be selected.