.:: EBSO semi-automatic SPA400NC ::.

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Your contact persons

Austria and Slovenia:
Jens-Christian Thomsen
+43 1 74040 221
+43 664 3006534
jc.thomsen(at)att.co.at

Romania and Bulgaria:
Stanco Vucovan
+40 733 104567
s.vucovan(at)att.co.at

Czech Rep. and Slovakia:
Ing. Pavel Tomásek
+421 911 886 886
p.tomasek(at)att.co.at

Ungarn:
István Bögyös
+36 22 505882
+36 20 9495477
i.bogyos(at)att.co.at

home » machines » soldering » selective soldering » EBSO semi-automatic SPA400NC

EBSO - semi-automatic SPA300NC

Ebso SPA400NC-Platform
Automatisches Selektivlötsystem

The Ebso SPA400 NC is an automatic selective soldering system with manual loading. Solder bath and solder pump is covered with nitrogen. Designed for automatic soldering of connectors, transformers, coils and other conventional components. Especially for applications which are not suitable for a wave soldering process or to automize hand soldering.

Features

Soldering area 400 x 400 mm (optional x = 500 y = 500)
3 axis CNC positioning system with Servoc drives
FTP interface to network
Digitale closed loop for N2 flow incl. standby function to reduce cost of ownership
Wave height control
Autom. solder wire feeder and solder level sensor
Flux tank and flux level monitoring
Control of all process parameters

• incl. monitoring function

• incl. maintenance and error messages

• incl. password protection
Exhaust function monitor
Control lamp freely configurable
Operating state and maintenance indicator (optional with wireless network to PC)
Windows CE colour display
Timer function
Internal data management for program storing 5MB
Software update via USB or CF card
Glas hood and storing compartments
ESD-paint RAL 7035 (light gray) and RAL 7016 (anthracite)

Transport angele: 7° oder 0°

Solder area options: Standard 400 x 400

Solder pot features and options

All solder pots made of Titanium
Reliabilty at highes operational availability due to quick release

Quick Release Pump

Easy change pot system for lead free production
Single solder pot with just 20 kg solder capacity
Soldering over 2 soldering pots
Dual solder nozzle for simultaneous soldering

Solder nozzle options

Max. clearance at solder side 40 mm
Wetable nozzle 3-12 mm inner diameter
Jet nozzle 5 – 60 mm
Wave nozzle 300 mm
Special nozzle for dipping process

Fluxer options

Max. 4 fluxer in any combination
Single spray / single microdrop
Dual spray / dual microdrop
Combination of single or dual ppray and microdrop

Adjustable preheaters

Convection line preheater
IR line or area preheater
Top side IR preheater

Further optionen

Fluxerspray test function
Witness colour camera including TFT monitor
AOI for solder control
Barcode or datamatrixCode with BDA (Traceability)
• Solder frame indentification over RFID-chip
• incl. soldering protocol
• incl. process data recorder

Programming

Offline editor
• incl. photo editing
• or import functions

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SPA 300NC

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