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3D inline Planar CT X-Ray

SAKI 3Xi-M110 high-resolution "Planar CT"  Inline XRay system

This platform offers newest technology as:

- Volumetric inspection
  discovers assembly defects that cannot
  be seen using external
  inspections alone.
- High resolution & High Speed
- reduce x-ray exposure by 70%
- Ultra fast programming
- small footprint

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3Xi-M110 newest X-Ray eneration from SAKI, offers excellent quality and technical data.

Able to distinguish shapes of non-wetting faults such as BGA head-in-pillow, which are difficult to detect. Capable of analyzing both void volume ratio and void area ratio.

By measuring the solder quantity in through-holes (filling rate), the system reliably discovers defects in THT assemblies that that standard tomography inspection systems would overlook.

Technical details
tube power110kV
resolution10 - 30µm
Max. PCB size
PCB weight
260 x 510mm
10 kg max.

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3D inline Planar IGBT CT X-Ray

SAKI 3Xi-M200 high-resolution "Planar CT"  Inline IGBT XRay system

This platform offers newest high Power X-ray technology as:

- Volumetric inspection
  discovers assembly defects that cannot
  be seen using external
  inspections alone.
- High resolution & High Speed
- Ultra fast programming
- small footprint

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3Xi-M200 newest IGBT X-Ray generation from SAKI, offers excellent quality and technical data.

Clearer inspection of voids by processing image to remove shadows of external cooling fins.
Automatic measurement and image correction of part warpage ensures high-precision inspection.

Advanced image-processing software removes images of DBC traces that interfere with inspection,
enabling more accurate measurement of voids.

 

Technical details
tube power200kV
resolution25 - 80µm
Max. PCB size
PCB weight
360 x 330mm
10 kg max.

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