- Soldering material
- Solderpaste
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Printing paste
AIM, a leading global manufacturer of solder assembly materials
for the electronics industry, introduces M8 Solder Paste, a high
reliability no clean paste.
| • | Available with SAC305; REL61;REL22; PB alloy |
| • | Halogen-free |
| • | Low voiding on BGA and BTC components |
| • | REACH and RoHS compliant |
| • | For use with demanding, high density electronic assemblies |
| • | High SIR/Electrically safe residue |
| • | Formulated for use with T4 or finer powder |
| • | Mitigates head-in-pillow |
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Dispensing paste
AIM’s dispensing paste are designed for high end industrial applications. the own made power guarantee a top quality.
Pastes are available for:
- Repair applications
- Screw valves
- Jet valves
- Mycronic Jet valve
Features:
- Clear Pin-Probe Testable Residue
- Excellent Wetting, Even Leadless Devices
- Reduces Voiding Under Micro-BGAs
- 12-14 Hour Tack Time- Vapor Phase Compatible
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Available pastes are:
| M8 | NC257LT | J8 | NC257MD | |
|---|---|---|---|---|
| time_pressure | X | X | ||
| screw valve | X | X | ||
| volume screw | X | X | ||
| Jet valve | X | |||
| Mycronic JET | X | |||
| Printer paste | X | X | ||
| SAC | X | X | X | |
| SN100C | X | X | ||
| SN/Bi | X |