AIM NEW M8 solder paste
M8 SAC305 T4 solderpaste
AIM, a leading global manufacturer of solder assembly materials
for the electronics industry, introduces M8 Solder Paste, a high
reliability no clean paste for use with SAC305 and Sn/Pb alloys.
| • | Halogen-free |
| • | Low voiding on BGA and BTC components |
| • | REACH and RoHS complient |
| • | For use with demanding, high density electronic assemblies |
| • | High SIR/Electrically safe residue |
| • | Formulated for use with T4 or finer powder |
| • | Mitigates head-in-pillow |
AIM NC259 Solderpaste
NC259 SN100C® solderpaste
AIM, a leading global manufacturer of solder assembly materials
for the electronics industry, is pleased to offer NC259 Solder Paste,
desinged specifically for use with SN100C® and other no- and low-silver alloys.
| • | For use with SN100C® and other silver alloys |
| • | Exceptional cost savings |
| • | Enhances fine print definition |
| • | Consistent solder volume transfer |
| • | Reduces voiding |
| • | Mitigates head-in-pillow |
| • | Low post-process residues |
NC257MD High Speed jetting paste
NC259MD High Speed jetting solder paste
NC257MD solder paste has been specifically designed for High Speed solder paste jet- printer.
Its unique rheological properties were engineered and validated through
extensive testing to provide continuous and consistent deposits.
| • | Designed for High Speed solder paste jet- printer |
| • | Clear Pin-Probe Testable Residue |
| • | Excellent Wetting, Even Leadless Devices |
| • | Reduces Voiding Under Micro-BGAs |
| • | 12-14 Hour Tack Time |
| • | Vapor Phase Compatible |
NC277 VOC-free Liquid flux
AIM NC277 VOC-free flux
NC277 Liquid Flux is a water-based VOC-Free flux that has performance and reliability characteristics equal or superior to many alcohol-based fluxes. A medium-solids/residue flux, NC277 has an exceptionally durable and powerful activator system making it ideally suited for high thermal mass assemblies such as backplanes, power management, servers and palletized assemblies. NC277 can be used with all common lead-free wave soldering alloys including tin-silver-copper, tinsilver, tin-copper, and others
| • | Halide-free |
| • | Environmentally safe |
| • | Non- flammable / non-corrosive |
| • | Lower material handling cost |
| • | Excellent in Extended dwell time |
| • | Withstands high thermal preheats |
| • | Excellent PTH top side fill |
| • | Passes the stringent IPC SIR 2.6.3.7 test air-dried |
NC275LR VOC-free Liquid flux
AIM NC275LR Low Residue VOC-free flux
NC275LR is a water-based, halide-free, no-clean liquid flux formulated to offer a very wide process window allowing for extremely good wetting, even to difficult-to-wet materials. NC275LR offers low post-process residues and has proven to reduce preventative maintenance requirements for spray fluxing applications. NC275LR is designed to be a no-clean, non-visible residue flux, which can be cleaned if critical to the product application.
| • | VOC Exempt According to ASTM D3960-98 |
| • | Low Post Process Residues |
| • | Passes IPC SIR-004 B |
| • | Lead-Free Compatible |
| • | Excellent in Extended Dwell Time |
| • | Halide-Free |
| • | Excellent Wetting |
NC265 and NC265LR IPA-based flux
AIM NC265 IPA-based flux
NC265 IPA-based Liquid Flux is compatible to tin lead and lead free applications. It offers optimal
performance for all wave and selective soldering process.
Long heating, as well by high temperature, Performance will be perfect for good wetted solder joins.
Useful for foam and spray fluxing stations.
| • | Halide-free |
| • | Rosin / Resin free |
| • | Low Post- Process Residues |
| • | Broad process window |
| • | Fast wetting for SN100C & SAC alloy |
| • | Lead free & tin-lead compatible |
| • | Available in Industry Standard Size |
Solderbars
Solderbars
AIM implemented the new production in Polen with new machines for High End production for all solder material. This includes also the newest solder foundry and drawing machines. The alloy row is strongly checked by AIM international Quality standards. This guaranty the best material for our customers for high quality standard production.
| • | Produced from High Purity Virgin Metals |
| • | Low Oxide Content |
| • | Low Drossing Rate |
| • | Reduces Defects Such as Bridging and Icicling |
| • | Excellent Joint Strength and Aesthetics |
| • | Fast Barrel Fill and Excellent Wetting |
| • | Available in Extruded, Cast, and Margash Bars |
| • | Available in all Alloys, Including Tin-Lead and Lead-Free |
AIM autofeed solder wire for Wave and Selectice
AIM autofeed solder wire
AIM, a leading global manufacturer of solder assembly materials
for the electronics industry, draw wire on AIM highest quality level on brand new drawing
machines in Polen. The alloy material is strongly Quality check on international standard.
AIM Glow Core solder wire
AIM GlowCore Hand solder wire
AIM offers the best combination of high Quality solder alloy with no clean flux based on latest standards of the electronic industries.
| • | Tin-Lead and Lead-Free Compatible |
| • | Low Post-Process Residues |
| • | Good Wetting |
| • | Drop-In For No-Clean Applications |
| • | Can Be Cleaned With Saponifier |
| • | IPC Compliant |
| • | Available in industry standard sizes |
Preform solder
Preform solder
AIM, a leading global manufacturer of high quality solder material, offers a wide range of preform solder pads for Standard and also custom inquiries. The standard product range includes pads for typical standard component package. It is available in many different solder alloys.
| • | Produced from High Purity Virgin Metals |
| • | Tin lead and lead free alloys |
| • | Custom alloys available |
| • | Wide standard size product range |