- Pick & Place
- Multifunctional assembly machines
Compact multi-functional placer
Essemtec FOX
compact multifunctional and modular ALL ROUND P&P
with optional fully integrated dispensing process tool.
- Simply P&P and Modular
- 1, 2, or 4 P&P heads
- Mineral base high accuracy and reparability
- Fully integrated Dispensing
Time/ pressure
Screw valve
Glue Jet Valve
Solder- paste Jet
- Stand Alone or Inline
- Single or bundle installation
The FOX family is without any compromise for prototyping and high flex SMD production. Intelligent feeder concept for fast changeover, the All-In ePlace Software includes CAD import and virtual component by programming offers a very high flex solution.
| Technical | details |
|---|---|
| Fox 1 | 6.100 cph* |
| Fox 2 | 10.800 cph* |
| Fox 4 | 16.100 cph* |
| accuracy | IPC9850 (@50 µm, 3σ) |
| Feedercap | 200 x 8mm |
| + up to 4 trays | |
| Component range | 01005 - 80x80 mm |
| Max. PCB size | 305 x 406 mm |
| Dispensing | up to 150.000 d/h |
| Disp. process | glue; paste; dam and fill, underfill |
| Special | 2,5D P&P & dispensing |
* cph by IPC 9850 chip
Video: FOX-Video
High Flex multi-functional assembly machine
Essemtec PUMA
multifunctional and modular ALL ROUND P&P
with high feeder capacity and optional up to 2x fully integrated dispensing process tool.
- Simply P&P and Modular
- 1, 2, or 4 P&P heads
- Mineral base high accuracy and reparability
- 1 or 2 Fully integrated Dispensing
Time/ pressure
Screw valve
Glue Jet Valve
Solder- paste Jet
- Stand Alone or Inline
- Single or bundle installation
The Puma from Essemtec provides a very high flex SMD placement machine. With 280 x 8mm lanes, simply tape feed in feeders, intuitive touchscreen GIU, linear drive, many wizards for easy use and big placement area and the machine is the most flexible solution on the market.
| Technical | details |
|---|---|
| Puma 1 | 5.800 cph* |
| Puma 2 | 10.100 cph* |
| Puma 4 | 15.300 cph* |
| accuracy | IPC9850 (@50 µm, 3σ) |
| Feedercap | up to260 x 8mm |
| + up to 4 trays | |
| Component range | 01005 - 80x80 mm |
| Max. PCB size | 560 x 610 mm |
| Dispensing | up to 150.000 d/h |
| Disp. process | glue; paste; dam and fill, underfill |
| Special | 2,5D P&P & dispensing |
* cph by IPC 9850 chip
Video: Puma Video