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SIPLACE SX

ASM SIPLACE SX Placement solution

SIPLACE SX, #1 placement solution for high mix electronics production


With the SIPLACE SX, your factory is ready for anything that comes along. The SIPLACE SX was designed to be flexible. It is the world's only platform that lets you scale up or down or transfer capacity by adding or removing the unique SX gantries

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  • Capacity on Demand:
  • Scale the performance of your SMT lines up or down as needed - quickly and easily
  • SIPLACE SpeedStar
  • for high-speed and placement of components as small as 0201 (metric) with maximum precision
  • SIPLACE TwinStar:
  • The head for special tasks
  • SIPLACE MultiStar:
  • Switches between placement modes on demand
  • ASM Smart Transport Module:
  • Process PCBs with lengths of up to 1.525 meters
  • LED centering:
  • Align components based on top-side features Place critical components reliable with the SIPLACE OSC Package
  • Touchless placement:
  • Maximum placement quality for highly sensitive components
  • SIPLACE SpeedStar and SIPLACE MultiStar heads can operate jointly in the same placement area for more flexibility and performance.
  • SIPLACE Smart Pin Support:
  • Automated pin support for printed circuit boards

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SIPLACE CA

The SIPLACE CA is a Chip assembly and SMT placement in a single machine.

Integrate high-growth technologies of the future such as flip chips and die attach into your SMT production with the SIPLACE CA, the world’s first platform that lets you flexibly combine the placement of bare dies directly from the wafer with classic feeder-based SMT placement

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SIPLACE X S

ASM SIPLACE X-s Placement solution

SIPLACE X-s, The benchmark in high-volume production

Absolute precision and maximum performance have made the SIPLACE X-s the placement platform of choice for demanding high-volume production applications such as network infrastructure (5G), large boards for server and industrial segments. Wherever top speed, lowest dpm rates, non-stop setup changeovers, fast new product introductions and the high-speed placement of the latest generations of super-small components (0201 metric) are needed - the SIPLACE X-s delivers.

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  • SIPLACE SpeedStar
  • For high-speed and placement of components as small as 0201 (metric) with maximum precision
  • SIPLACE MultiStar
  • The only head that automatically changes modes on demand (C&P, P&P, Mixed Mode)
  • SIPLACE TwinStar
  • The head for special tasks
  • Digital SIPLACE vision system
  • For maximum process stability
  • Genties:
  • Available with two, three and four gantries and smart conveyor options for optimized line configurations
  • Modular
  • Gantries to meet any production challenges
  • Automatic Smart Pin Support
  • For perfectly controlled pcb support

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SIPLACE TX micron

ASM SIPLACE TX Placement solution

SIPLACE TX, Faster, smaller, advanced - the new high-end placement solution


The latest generation of our placement modules sets new records in speed, floorspace performance and accuracy for high-volume production applications. And for the first time, 0201 (metric) components can be placed at the highest speed.

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  • SIPLACE SpeedStar
  • with up to 48,000 cph and
    maximum component size of 8.2 mm x 8.2 mm x 4 mm
    with a placement accuracy of up to 25 µm/3 sigma
  • SIPLACE MultiStar:
  • Up to 25,500 cph SIPLACE
  • TwinStar:
  • The head for special tasks
  • SIPLACE JEDEC Tray Feeder
  • with up to 18 JEDEC trays
  • SIPLACE TX micron:
  • Placement accuracy of up to 15 µm @ 3 sigma More flexibility and performance through the combination of SIPLACE SpeedStar and SIPLACE MultiStar
  • heads in a single placement area Placement force down to 0.5 N for sensitive components
  • Touchless placement:
  • Maximum placement quality for highly sensitive components
  • SIPLACE Smart Pin Support:
  • Automated pin mounting for PCBs
  • Maximum PCB size: 550 mm x 460 mm

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