- Inspection
- X-Ray Inspection
3D inline Planar CT X-Ray
SAKI 3Xi-M110 high-resolution "Planar CT" Inline XRay system
This platform offers newest technology as:
- Volumetric inspection
discovers assembly defects that cannot
be seen using external
inspections alone.
- High resolution & High Speed
- reduce x-ray exposure by 70%
- Ultra fast programming
- small footprint
3Xi-M110 newest X-Ray eneration from SAKI, offers excellent quality and technical data.
Able to distinguish shapes of non-wetting faults such as BGA head-in-pillow, which are difficult to detect. Capable of analyzing both void volume ratio and void area ratio.
By measuring the solder quantity in through-holes (filling rate), the system reliably discovers defects in THT assemblies that that standard tomography inspection systems would overlook.
| Technical details | |
|---|---|
| tube power | 110kV |
| resolution | 10 - 30µm |
| Max. PCB size PCB weight | 260 x 510mm 10 kg max. |
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3D inline Planar IGBT CT X-Ray
SAKI 3Xi-M200 high-resolution "Planar CT" Inline IGBT XRay system
This platform offers newest high Power X-ray technology as:
- Volumetric inspection
discovers assembly defects that cannot
be seen using external
inspections alone.
- High resolution & High Speed
- Ultra fast programming
- small footprint
3Xi-M200 newest IGBT X-Ray generation from SAKI, offers excellent quality and technical data.
Clearer inspection of voids by processing image to remove shadows of external cooling fins.
Automatic measurement and image correction of part warpage ensures high-precision inspection.
Advanced image-processing software removes images of DBC traces that interfere with inspection,
enabling more accurate measurement of voids.
| Technical details | |
|---|---|
| tube power | 200kV |
| resolution | 25 - 80µm |
| Max. PCB size PCB weight | 360 x 330mm 10 kg max. |
more details